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d a t a sh eet product speci?cation supersedes data of 2003 feb 04 2003 may 14 74alvc04 hex inverter integrated circuits
2003 may 14 2 philips semiconductors product speci?cation hex inverter 74alvc04 features wide supply voltage range form 1.65 to 3.6 v 3.6 v tolerant inputs/outputs cmos low power consumption direct interface with ttl levels (2.7 to 3.6 v) power-down mode latch-up performance exceeds 250 ma complies with jedec standard: jesd8-7 (1.65 to 1.95 v) jesd8-5 (2.3 to 2.7 v) jesd8b/jesd36 (2.7 to 3.6 v). esd protection: hbm eia/jesd22-a114-a exceeds 2000 v mm eia/jesd22-a115-a exceeds 200 v. description the 74alvc04 is a high-performance, low-power, low-voltage, si-gate cmos device and superior to most advanced cmos compatible ttl families. schmitt-trigger action at all inputs makes the circuit tolerant for slower input rise and fall times. the 74alvc04 provides six inverting buffers. quick reference data gnd = 0 v; t amb =25 c. notes 1. c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ s (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in volts; n = total load switching outputs; s (c l v cc 2 f o ) = sum of the outputs. 2. the condition is v i = gnd to v cc . symbol parameter conditions typical unit t phl /t plh propagation delay na to ny v cc = 1.8 v; c l = 30 pf; r l =1k w 2.4 ns v cc = 2.5 v; c l = 30 pf; r l = 500 w 1.8 ns v cc = 2.7 v; c l = 50 pf; r l = 500 w 2.3 ns v cc = 3.3 v; c l = 50 pf; r l = 500 w 2.0 ns c i input capacitance 3.5 pf c pd power dissipation capacitance per buffer v cc = 3.3 v; notes 1 and 2 26 pf
2003 may 14 3 philips semiconductors product speci?cation hex inverter 74alvc04 ordering information function table see note 1. note 1. h = high voltage level; a) l = low voltage level. type number package temperature range pins package material code 74alvc04d - 40 to +85 c 14 so14 plastic sot108-1 74alvc04pw - 40 to +85 c 14 tssop14 plastic sot402-1 74ALVC04BQ - 40 to +85 c 14 dhvqfn14 plastic sot762-1 input output na ny lh hl pinning pin symbol description 1 1a data input 2 1y data output 3 2a data input 4 2y data output 5 3a data input 6 3y data output 7 gnd ground (0 v) 8 4y data output 9 4a data input 10 5y data output 11 5a data input 12 6y data output 13 6a data input 14 v cc supply voltage handbook, halfpage mna340 04 1 2 3 4 5 6 7 8 14 13 12 11 10 9 1a 1y 2a 2y 3a 3y gnd 4y 4a 5y 5a 6y 6a v cc fig.1 pin configuration so14 and tssop14.
2003 may 14 4 philips semiconductors product speci?cation hex inverter 74alvc04 handbook, halfpage 114 gnd (1) 1a v cc 7 2 3 4 5 6 1y 2a 2y 3a 3y 13 12 11 10 9 6a 6y 5a 5y 4a 8 gnd top view 4y mbl760 fig.2 pin configuration dhvqfn14. (1) the die substrate is attached to this pad using conductive die attach material. it can not be used as a supply pin of input. handbook, halfpage mna341 a y fig.3 logic diagram (one inverter). fig.4 logic symbol. handbook, halfpage mna342 1a 1y 1 2 2a 2y 3 4 3a 3y 5 6 4a 4y 9 8 5a 5y 11 10 6a 6y 13 12 fig.5 iec logic symbol. handbook, halfpage 1 1 2 mna343 3 1 4 5 1 6 9 1 8 11 1 10 13 1 12
2003 may 14 5 philips semiconductors product speci?cation hex inverter 74alvc04 recommended operating conditions limiting values in accordance with the absolute maximum rating system (iec 60134); voltages are referenced to gnd (ground = 0 v). notes 1. the input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. when v cc = 0 v (power-down mode), the output voltage can be 3.6 v in normal operation. 3. for so14 packages: above 70 c derate linearly with 8 mw/k. a) for tssop14 packages: above 60 c derate linearly with 5.5 mw/k. b) for dhvqfn14 packages: above 60 c derate linearly with 4.5 mw/k. symbol parameter conditions min. max. unit v cc supply voltage 1.65 3.6 v v i input voltage 0 3.6 v v o output voltage v cc = 1.65 to 3.6 v 0 v cc v v cc = 0 v; power-down mode 0 3.6 v t amb operating ambient temperature - 40 +85 c t r ,t f input rise and fall times v cc = 1.65 to 2.7 v 0 20 ns/v v cc = 2.7 to 3.6 v 0 10 ns/v symbol parameter conditions min. max. unit v cc supply voltage - 0.5 +4.6 v i ik input diode current v i <0 -- 50 ma v i input voltage - 0.5 +4.6 v i ok output diode current v o >v cc or v o <0 - 50 ma v o output voltage notes 1 and 2 - 0.5 v cc + 0.5 v power-down mode; note 2 - 0.5 +4.6 v i o output source or sink current v o =0tov cc - 50 ma i cc , i gnd v cc or gnd current - 100 ma t stg storage temperature - 65 +150 c p tot power dissipation t amb = - 40 to +85 c; note 3 - 500 mw
2003 may 14 6 philips semiconductors product speci?cation hex inverter 74alvc04 dc characteristics at recommended operating conditions; voltages are referenced to gnd (groun d=0v). note 1. all typical values are measured at t amb =25 c. symbol parameter test conditions min. typ. (1) max. unit other v cc (v) t amb = - 40 to +85 c v ih high-level input voltage 1.65 to 1.95 0.65 v cc -- v 2.3 to 2.7 1.7 -- v 2.7 to 3.6 2 -- v v il low-level input voltage 1.65 to 1.95 -- 0.35 v cc v 2.3 to 2.7 -- 0.7 v 2.7 to 3.6 -- 0.8 v v ol low-level output voltage v i =v ih or v il i o = 100 m a 1.65 to 3.6 -- 0.2 v i o = 6 ma 1.65 - 0.11 0.3 v i o =12ma 2.3 - 0.17 0.4 v i o =18ma 2.3 - 0.25 0.6 v i o =12ma 2.7 - 0.16 0.4 v i o =18ma 3.0 - 0.23 0.4 v i o =24ma 3.0 - 0.30 0.55 v v oh high-level output voltage v i =v ih or v il i o = - 100 m a 1.65 to 3.6 v cc - 0.2 -- v i o = - 6 ma 1.65 1.25 1.51 - v i o = - 12 ma 2.3 1.8 2.10 - v i o = - 18 ma 2.3 1.7 2.01 - v i o = - 12 ma 2.7 2.2 2.53 - v i o = - 18 ma 3.0 2.4 2.76 - v i o = - 24 ma 3.0 2.2 2.68 - v i li input leakage current v i = 3.6 v or gnd 3.6 - 0.1 5 m a i off power off leakage current v i or v o = 3.6 v 0.0 - 0.1 10 m a i cc quiescent supply current v i =v cc or gnd; i o = 0 3.6 - 0.2 20 m a d i cc additional quiescent supply current per input pin v i =v cc - 0.6 v; i o = 0 3.0 to 3.6 - 5 750 m a
2003 may 14 7 philips semiconductors product speci?cation hex inverter 74alvc04 ac characteristics note 1. all typical values are measured at t amb =25 c. ac waveforms symbol parameter test conditions min. typ. (1) max. unit waveforms v cc (v) t amb = - 40 to +85 c t phl /t plh propagation delay na to ny see figs 6 and 7 1.65 to 1.95 1.0 2.4 4.4 ns 2.3 to 2.7 1.0 1.8 3.0 ns 2.7 1.0 2.3 3.3 ns 3.0 to 3.6 1.0 2.0 2.8 ns handbook, halfpage mna344 t phl t plh v m v m na input ny output gnd v i v oh v ol fig.6 inputs na to output ny propagation delay times. v cc v m input v i t r =t f 1.65 to 1.95 v 0.5 v cc v cc 2.0 ns 2.3 to 2.7 v 0.5 v cc v cc 2.0 ns 2.7 v 1.5 v 2.7 v 2.5 ns 3.0 to 3.6 v 1.5 v 2.7 v 2.5 ns
2003 may 14 8 philips semiconductors product speci?cation hex inverter 74alvc04 handbook, full pagewidth v ext v cc v i v o mna616 d.u.t. c l r t r l r l pulse generator fig.7 load circuitry for switching times. definitions for test circuit: r l = load resistor. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v cc v i c l r l v ext t plh /t phl t pzh /t phz t pzl /t plz 1.65 to 1.95 v v cc 30 pf 1 k w open gnd 2 v cc 2.3 to 2.7 v v cc 30 pf 500 w open gnd 2 v cc 2.7 v 2.7 v 50 pf 500 w open gnd 6 v 3.0 to 3.6 v 2.7 v 50 pf 500 w open gnd 6 v
2003 may 14 9 philips semiconductors product speci?cation hex inverter 74alvc04 package outlines unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1
2003 may 14 10 philips semiconductors product speci?cation hex inverter 74alvc04 unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot402-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 17 14 8 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 a max. 1.1 pin 1 index
2003 may 14 11 philips semiconductors product speci?cation hex inverter 74alvc04 terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.1 2.9 d h 1.65 1.35 y 1 2.6 2.4 1.15 0.85 e 1 2 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot762-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot762-1 dhvqfn14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 26 13 9 8 7 1 14 x d e c b a 02-10-17 03-01-27 terminal 1 index area a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1)
2003 may 14 12 philips semiconductors product speci?cation hex inverter 74alvc04 soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferably be kept: below 220 c for all the bga packages and packages with a thickness 3 2.5mm and packages with a thickness <2.5 mm and a volume 3 350 mm 3 so called thick/large packages below 235 c for packages with a thickness <2.5 mm and a volume <350 mm 3 so called small/thin packages. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2003 may 14 13 philips semiconductors product speci?cation hex inverter 74alvc04 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is suitable for lqfp, tqfp and qfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package (1) soldering method wave reflow (2) bga, lbga, lfbga, sqfp, tfbga, vfbga not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, hvson, sms not suitable (3) suitable plcc (4) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (4)(5) suitable ssop, tssop, vso, vssop not recommended (6) suitable
2003 may 14 14 philips semiconductors product speci?cation hex inverter 74alvc04 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 may 14 15 philips semiconductors product speci?cation hex inverter 74alvc04 notes
? koninklijke philips electronics n.v. 2003 sca75 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 613508/02/pp 16 date of release: 2003 may 14 document order number: 9397 750 11269

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